4. Geometrical instruments
  5. Straightedge type
  6. Rules

Klaus Feldner

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Integrated circuit interconnection employing tungsten/aluminum l

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Method for planarizing an isolating layer

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate

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Method for producing an insulation

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Method for providing bitline contacts in a memory cell array...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Method of fabricating integrated circuit interconnection employi

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-414509

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