4. Cutting
  5. Processes

Kim Hwee Tan

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Device having wire bond and redistribution layer

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Die pillar structures and a method of their formation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Encapsulated circuit using vented mold

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
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Method and apparatus for cutting a substrate

Cutting – Processes
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Method for forming a flip chip on leadframe semiconductor...

Metal fusion bonding – Process – Plural joints
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Profile ID: LFUS-PAI-P-2092180

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