Device having wire bond and redistribution layer

Details Device having wire bond and redistribution layer Device having wire bond and redistribution layer

2010-08-23

2011-11-15

Zarneke, David (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257SE23114

Reexamination Certificate

active

08058712

ABSTRACT:
A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.

REFERENCES:
patent: 5747870 (1998-05-01), Pedder
patent: 6180445 (2001-01-01), Tsai
patent: 6355535 (2002-03-01), Liou
patent: 6511901 (2003-01-01), Lam et al.
patent: 6586273 (2003-07-01), Aiba et al.
patent: 6636139 (2003-10-01), Tsai et al.
patent: 6674174 (2004-01-01), Chungpaiboonpatana et al.
patent: 6800930 (2004-10-01), Jackson et al.
patent: 7436683 (2008-10-01), Shen
patent: 2007/0275503 (2007-11-01), Lin et al.

Affiliated with

Also associated with

Rating

Device having wire bond and redistribution layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device having wire bond and redistribution layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device having wire bond and redistribution layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4277633