4. Semiconductor device manufacturing: process
  5. Forming schottky junction

Ki Woong Chung

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Integrated circuit module package and assembly method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Method for fabricating semiconductor device

Semiconductor device manufacturing: process – Forming schottky junction
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Multilayer integrated circuit for RF communication and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multilayer integrated circuit for RF communication and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1238642

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