Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-11-07
2006-11-07
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S777000, C257S686000, C257S685000, C438S108000, C438S109000, C361S760000, C340S572500
Reexamination Certificate
active
07132747
ABSTRACT:
A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package comprises a radio frequency integrated circuit (RFIC) attached to a recessed area of a lead frame. The RFIC has an active integrated circuit pattern and a plurality of conductors formed on input/output pads of the active integrated circuit pattern. An integrated passive device (IPD) is attached to the RFIC via the plurality of conductors. The IPD has a passive integrated circuit pattern, a plurality of electrode pads connected to nodes of the passive integrated circuit pattern, and metal-filled vias for electrically connecting the electrode pads to the plurality of conductors. The RFIC includes a plurality of heat conducting vias for conducting heat to the lead frame.
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U.S. Appl. No. 10/932,409, filed Sep. 1, 2004, Integrated Circuit Module Package and Assembly Method Thereof, Youngwoo Kwon.
Chung Ki Woong
Kwon Youngwoo
Chu Chris C.
Parker Kenneth
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