Integrated circuit module package and assembly method thereof

Details Integrated circuit module package and assembly method thereof Integrated circuit module package and assembly method thereof

2004-09-01

2011-11-29

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23037, C257SE23057, C257SE23092, C257SE25031

Reexamination Certificate

active

08067824

ABSTRACT:
An integrated circuit module package includes a lead frame having a recessed area. A semiconductor die containing active electrical components is attached to the recessed area of the lead frame. An integrated passive device containing passive electrical components is vertically stacked with, and electrically coupled to, the semiconductor die. An optional heat sink is attached to the integrated passive device. The integrated passive device is connected to the lead frame by conductors to electrically couple the integrated passive device and the semiconductor die to circuitry external to the integrated circuit module package. A cap is then attached to the heat sink or the integrated passive device to protect the semiconductor die and the integrated passive device. The integrated circuit module package dissipates heat from the semiconductor die through the lead frame, and dissipates heat from the integrated passive device through the cap and optional heat sink.

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