4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Kevin Shawn Petrarca

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High density area array solder microjoining interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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High density area array solder microjoining interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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High density raised stud microjoining system and methods of...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Internally reinforced bond pads

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Internally reinforced bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2064761

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