4. Electrical generator or motor structure
  5. Non-dynamoelectric
  6. Piezoelectric elements and devices

Kevin K. Lin

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Method of assembling a wafer-level package filter

Metal working – Method of mechanical manufacture – Electrical device making
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Wafer level packaging of materials with different...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Wafer level packaging of materials with different...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Wafer-level surface acoustic wave filter package with...

Wave transmission lines and networks – Coupling networks – Electromechanical filter
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Profile ID: LFUS-PAI-P-2959433

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