Wave transmission lines and networks – Coupling networks – Electromechanical filter
Reexamination Certificate
2007-06-12
2007-06-12
Takaoka, Dean (Department: 2817)
Wave transmission lines and networks
Coupling networks
Electromechanical filter
C333S133000
Reexamination Certificate
active
10921479
ABSTRACT:
A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal expansion of the piezoelectric substrate. Interdigital transducers are formed on the piezoelectric substrate so as to form a SAW composite die structure. A cap substrate having a coefficient of thermal expansion similar to that of the carrier substrate is bonded to the SAW composite die structure for enclosing the interdigital transducers. Plated vias form signal pad interconnects to input and output pads of the interdigital transducer and a sealing pad formed on the surface of the piezoelectric substrate bonds the SAW composite die structure to the cap substrate.
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Carpenter Charles
Chocola Jack
Lin Kevin K.
Welsh Phillip
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Takaoka Dean
Triquint, Inc.
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