4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With separate tie bar element or plural tie bars

Kevin J. Haley

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Diamond heat spreading and cooling technique for integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Diamond heat spreading and cooling technique for integrated...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for mounting very small integrated circuit package on PCB

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Socketable BGA package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Utility Patent

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Socketable BGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-274264

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