Method for mounting very small integrated circuit package on PCB

Details Method for mounting very small integrated circuit package on PCB Method for mounting very small integrated circuit package on PCB

1993-07-16

1994-11-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29833, 437209, H05K 334

Patent

active

053597680

ABSTRACT:
A very small integrated circuit package. The package of the present invention includes a substrate or die coupled to a heatsink. The substrate or die has solder bumps for being directly mounted to a circuit board. The heatsink is coupled to the die before the die is mounted to the circuit board. The heatsink is mounted using adhesive. By mounting the heatsink before the die is mounted, the heatsink may be used to handle of the substrate or die during the manufacturing and testing process, thereby increasing the reliability of the die by increased protection.

REFERENCES:
patent: 3570115 (1971-03-01), Barnes
patent: 4023198 (1977-05-01), Malone et al.
patent: 4571826 (1986-02-01), Jacobs
patent: 4654966 (1987-04-01), Kohara et al.
patent: 4794981 (1989-01-01), Mizuno
patent: 4941255 (1990-07-01), Bull
patent: 4959900 (1990-10-01), deGivrr et al.
patent: 5222014 (1993-06-01), Lin
IBM Tech Discl. Bull vol. 25 No. 9 Sep. 1982 pp. 1954 by J. C. Edwards.

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