4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including contaminant removal or mitigation

Keum-Hee Ma

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Image sensor device and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Image sensor device and methods thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Image sensor device and methods thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Method for forming solder bump structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Stacked chip package using photosensitive polymer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2370185

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