Image sensor device and methods thereof

Details Image sensor device and methods thereof Image sensor device and methods thereof

2008-05-13

2008-05-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C438S118000

Reexamination Certificate

active

11342799

ABSTRACT:
An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.

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patent: 10-2002-0014519 (2002-02-01), None
patent: 10-2004-0061098 (2004-07-01), None

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