4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Kenneth Burton Gilleo

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Applying encapsulating material to substrates

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Flip chip having integral mask and underfill providing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Flip chip with integrated flux and underfill

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Flip chip with integrated mask and underfill

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Wafer coating method for flip chips

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1736256

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