Applying encapsulating material to substrates

Metal working – Method of mechanical manufacture – Electrical device making

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101123, 181120, 181213, 427209, H05K 330

Patent

active

060677090

ABSTRACT:
Providing encapsulated electronic components on a circuit board by providing dams on a circuit board around areas on which respective electronic components will be mounted, mounting the respective electronic components within the dams on the circuit board, and printing encapsulating material through a stencil in order to provide deposits of encapsulating material over the electronic components and within the dams.

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