4. Metal treatment
  5. Compositions
  6. Heat treating

Kenji Kubozono

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Copper alloy for an electronic device and method of preparing th

Alloys or metallic compositions – Copper base – Zinc containing
Patent

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Copper alloy for electronic parts, lead-frame, semiconductor dev

Alloys or metallic compositions – Copper base – Zinc containing
Patent

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Copper Ni-Si-P alloy for an electronic device

Metal treatment – Stock – Age or precipitation hardened or strengthened
Patent

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Cu-Ni-Sn alloy with excellent fatigue properties

Metal treatment – Stock – Age or precipitation hardened or strengthened
Patent

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Horizontal continuous casting method and its device

Metal founding – Process – Shaping liquid metal against a forming surface
Patent

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Profile ID: LFUS-PAI-P-83768

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