Copper alloy for electronic parts, lead-frame, semiconductor dev

Details Copper alloy for electronic parts, lead-frame, semiconductor dev Copper alloy for electronic parts, lead-frame, semiconductor dev

1997-02-19

1998-11-10

Ip, Sikyin

Alloys or metallic compositions

Copper base

Zinc containing

420473, 420481, H01B 100

Patent

active

058339205

ABSTRACT:
The present invention provides a copper alloy for electronic part which is excellent in adhesion of silver(Ag) and reliability of solderability and adhesion of plating without impairing excellent strength and electrical conductivity of a copper-nickel-silicon alloy. The copper alloy for electronic parts in the present invention consist essentially of 1.7 to 4.0% by weight of nickel, 0.3 to 0.8% by weight of silicon, 0.002 to 0.3% by weight of silver, 0.5 to 2.0% by weight of zinc, and a residual of copper.

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