Copper alloy for an electronic device and method of preparing th

Details Copper alloy for an electronic device and method of preparing th Copper alloy for an electronic device and method of preparing th

1989-03-21

1990-08-21

Morris, Theodore

Alloys or metallic compositions

Copper base

Zinc containing

420485, C22C 906

Patent

active

049504517

ABSTRACT:
A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg.
A wire of the above-mentioned copper alloy is prepared by heating the copper alloy having the composition described above at temperature of 750.degree. C.-950.degree. C. for more than one minute before the final rolling operation, and then, heating the material at a temperature of 350.degree. C.-500.degree. C., or slowly cooling it at a rate of 4.degree. C./min. or less, or cooling it at a rate of 1.degree. C./min. or more until temperature reaches 500.degree. C. and keeping its temperature for at least one hour in a temperature range of 500.degree. C.-350.degree. C.

REFERENCES:
patent: 2460991 (1949-02-01), LeBrasse et al.
patent: 4666667 (1987-05-01), Kamio et al.

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