4. Stock material or miscellaneous articles
  5. Structurally defined web or sheet
  6. Discontinuous or differential coating, impregnation or bond

Ken-ichi Kawai

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Method of making SOI structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Patent

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Parameter editing method and semiconductor exposure system

Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system – Software program
Reexamination Certificate

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Pb-Sn-Sb-In solder alloy

Alloys or metallic compositions – Tin base – Lead containing
Patent

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Planer

Machines not elsewhere specified – Material working – abrading – or founding machinery – Cutting
Patent

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Recording sheet with an ink absorbing layer

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2519693

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