Pb-Sn-Sb-In solder alloy

Alloys or metallic compositions – Tin base – Lead containing

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420566, 420571, 420587, 420589, C22C 1106, C22C 1300, C22C 3002, C22C 3004

Patent

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048698717

ABSTRACT:
Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.

REFERENCES:
patent: 2210593 (1940-08-01), McCullough
patent: 3607252 (1971-09-01), North
patent: 3945556 (1976-03-01), Manko
Soldering Manual, American Welding Society, 1959, pp. 21-23.

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