4. Electricity: electrical systems and devices
  5. Miscellaneous

Keiji Hazama

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Package structure for semiconductors

Special receptacle or package – For a building component – Shingle
Patent

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Packaging process for semiconductors

Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
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Process and apparatus for sealing semiconductor packages

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Semiconductor package structure

Electricity: electrical systems and devices – Miscellaneous
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Profile ID: LFUS-PAI-P-738431

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