Package structure for semiconductors

Details Package structure for semiconductors Package structure for semiconductors

1986-07-02

1988-02-02

Moy, Joseph M.

Special receptacle or package

For a building component

Shingle

220359, 220 82A, 220 82R, B65D 7302

Patent

active

047224410

ABSTRACT:
A semiconductor package having a special cap shell wherein a flat molding having a window space with at least one level difference around the window space at the inside thereof is fitted with an ultraviolet-light transmissible lid at the level difference and an adhesive which has excellent sealing properties covers the periphery of the lid and the molding along and across the fitted portion so as to fix the lid to the molding without causing peeling of the adhesive.

REFERENCES:
patent: 3241369 (1966-03-01), Wyzenbeek
patent: 3910448 (1975-10-01), Evans et al.
patent: 4109818 (1978-08-01), Hascoe et al.
patent: 4245749 (1981-01-01), Graves
patent: 4327832 (1982-05-01), deMatteo
patent: 4474306 (1984-10-01), Nakauchi et al.

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