Process and apparatus for sealing semiconductor packages

Details Process and apparatus for sealing semiconductor packages Process and apparatus for sealing semiconductor packages

1986-07-30

1988-08-16

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562722, 1562751, 156292, 1563084, 1563096, 1563099, 1563798, 156383, 156556, 156567, 156580, 264 25, 264248, 26427217, 414744R, B32B 3104, B32B 3120

Patent

active

047642351

ABSTRACT:
An apparatus and method are described for sealing semiconductor packages made from a thermoplastic resin wherein a lead frame is positioned vertically at a center axis of the apparatus and a pair of mold parts having cavities for housing flat moldings are positioned symmetrically as to said center axis. With the described method and apparatus, sealed semiconductor packages with excellent sealing properties can be produced.

REFERENCES:
patent: 4056881 (1977-11-01), Holt
patent: 4108704 (1978-08-01), Horne
patent: 4119481 (1978-10-01), Beckley
patent: 4305897 (1981-12-01), Hazama

Affiliated with

Also associated with

Rating

Process and apparatus for sealing semiconductor packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for sealing semiconductor packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for sealing semiconductor packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-598948