4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Kazutoshi Itou

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active

Metal-resin-boned structured body and resin-encapsulated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Power semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2341538

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