Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-06-21
2011-06-21
Choi, Ling-Siu (Department: 1762)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C427S318000, C427S319000, C427S535000, C427S553000
Reexamination Certificate
active
07964975
ABSTRACT:
A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.
REFERENCES:
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patent: 2007/0145606 (2007-06-01), Mahler et al.
patent: 58-202556 (1983-11-01), None
patent: 2007-508448 (2007-04-01), None
patent: 2007-266562 (2007-10-01), None
patent: WO 2005/021836 (2005-03-01), None
Mohamed Lebbai, et al., “Surface characteristics and adhesion performance of black oxide coated copper substrate with epoxy resins”, J. Adhesion Sci. Technol., 17, 2003, pp. 1543-1560.
JP Office Action of Appln. No. 2008-020045 dated May 18, 2010 with partial translation.
Hozoji Hiroshi
Itou Kazutoshi
Kajiwara Ryoichi
Motowaki Shigehisa
Antonelli, Terry Stout & Kraus, LLP.
Choi Ling-Siu
Hitachi , Ltd.
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