4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Kazutaka Shoji

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Method for forming protruding electrode

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Semiconductor device having a projecting electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent

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Semiconductor device with increased multi-bumps and adhered mult

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Profile ID: LFUS-PAI-P-339894

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