Semiconductor device

Details Semiconductor device Semiconductor device

1997-02-18

1998-12-08

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257783, 257693, 257738, 257780, H01L 2348, H01L 2352, H01L 2940, H01L 2329

Patent

active

058474560

ABSTRACT:
Solder bumps (3) are provided with reinforcing resins (4), which are formed by applying resins thickly at the roots and gradually thinly toward the tips so as to surround the bumps. Thus, long-time reliability of solder connection parts is improved and repairability is simultaneously improved.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5093986 (1992-03-01), Mandai et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5591941 (1997-01-01), Acocella et al.
"Electronic Packaging and Interconnection Hanbook", pp. 1.4-1.7; C. Harper.
Tsukada et al, Surface Laminar Circuit and Flip Chip Attach Packaging, IMC 1992 Proceedings, Yokohama, Jun. 3-Jun. 5, 1992, pp. 252-258.

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