Method for forming protruding electrode

Details Method for forming protruding electrode Method for forming protruding electrode

1997-09-19

2000-04-25

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427259, 4273722, 427282, 438613, 228254, 22818022, 228 563, B05D 512, H01L 2144, B23K 3514

Patent

active

060541717

ABSTRACT:
Disclosed is a method for forming a protruding electrode which has the steps of: forming a first film of an organic or polymeric material on the top portion of a protruding electrode formed on a protruding-electrode-forming plane; then forming a second film of a polymeric material on the protruding-electrode-forming plane to bury the base portion of the protruding electrode; and removing the first film after the second film is cured; wherein the first film is of the organic or polymeric material which has no affinity with the polymeric material of the second film.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5371328 (1994-12-01), Gutierrez et al.
patent: 5411760 (1995-05-01), Woodhall et al.
patent: 5656862 (1997-08-01), Papathomas et al.

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