Semiconductor device with increased multi-bumps and adhered mult

Details Semiconductor device with increased multi-bumps and adhered mult Semiconductor device with increased multi-bumps and adhered mult

1996-04-24

1998-05-26

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257774, 257778, 257780, H01L 2348

Patent

active

057570787

ABSTRACT:
A semiconductor device including a semiconductor chip having electrode pads, a package composed of a plurality of insulating films and adhered to the semiconductor chip by an adhesive agent. The package includes wiring patterns interposed between the plurality of insulating films, and the wiring patterns are selectively connected to the electrode pads at one end, and to the plurality of electrically conductive protrusions at the other end, via viaholes. The semiconductor device further includes a plurality of electrically conductive protrusions extending from the outermost wiring patterns via the viaholes provided in the outermost insulating film.

REFERENCES:
patent: 5289346 (1994-02-01), Carey et al.
patent: 5407864 (1995-04-01), Kim
patent: 5510758 (1996-04-01), Fujita et al.

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