4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Wire lead bonder

Kazuhiro Yamamori

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Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked semiconductor device and method of manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Wire bonder

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-291604

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