Wire bonder

Details Wire bonder Wire bonder

1992-12-03

1994-03-08

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, H01L 21603

Patent

active

052920500

ABSTRACT:
A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head and camera control unit detect locations of a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip. The program research unit calculates amounts of shift of the detected locations of the first and second bonding pads from reference locations thereof. The microcomputer corrects locations of first and second bonding points and those of first and second cutting points in accordance with the calculated amounts of shift. The control circuit and servo drive unit control the first and second bonding points and the first and second cutting points based on the corrected locations.

REFERENCES:
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4976393 (1990-12-01), Nakajima et al.
patent: 5126823 (1992-06-01), Otsuka et al.

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