Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2006-04-06

2009-08-04

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S782000, C257S777000, C257S784000, C438S109000, C438S118000

Reexamination Certificate

active

07569921

ABSTRACT:
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips arranged adjacently in up and down direction among the plurality of bare chips, and inner leads which are arranged at both sides in a horizontal direction of the support substrate and are connected to pads of the bare chips via bonding wires, wherein the bonding wires which connect the pads of the bare chips at one end side of the spacers to the corresponding inner leads, are arranged not to contact the bare chip at the other end side of the same spacer.

REFERENCES:
patent: 6710455 (2004-03-01), Goller et al.
patent: 6977439 (2005-12-01), Kang et al.
patent: 7030489 (2006-04-01), Kang et al.
patent: 2003/0047813 (2003-03-01), Goller et al.
patent: 2004/0104477 (2004-06-01), Fujisawa
patent: 2004/0222509 (2004-11-01), Ogata
patent: 9-51011 (1997-02-01), None

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