4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Kazuhiro Ikemura

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Adhesive film for manufacturing semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Epoxy resin composition for semiconductor encapsulation and semi

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Epoxy resin composition for semiconductor encapsulation and...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Epoxy resin composition for semiconductor encapsulation, and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Epoxy resin composition for semiconductor encapsulation,...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1341413

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