Epoxy resin composition for semiconductor encapsulation, and...

Details Epoxy resin composition for semiconductor encapsulation, and... Epoxy resin composition for semiconductor encapsulation, and...

2007-09-04

2007-09-04

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S789000, C257S793000, C525S481000, C525S507000

Reexamination Certificate

active

10703494

ABSTRACT:
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

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