4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Kazuhiko Mitobe

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Apparatus for a vertically accumulable semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Bump-forming method using two plates and electronic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Gantry-type XY stage

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method for fabricating solder bumps by forming solder balls with

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method for producing a semiconductor device, base member for sem

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Profile ID: LFUS-PAI-P-64305

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