Method for producing a semiconductor device, base member for sem

Details Method for producing a semiconductor device, base member for sem Method for producing a semiconductor device, base member for sem

1998-02-18

2000-02-08

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438109, 438118, 438125, H01L 2144, H01L 2158

Patent

active

060227591

ABSTRACT:
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

REFERENCES:
patent: 4635093 (1987-01-01), Ross
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4864470 (1989-09-01), Nishio
patent: 5281852 (1994-01-01), Normington
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5703398 (1997-12-01), Sono et al.
patent: 5747874 (1998-05-01), Seki et al.

Affiliated with

Also associated with

Rating

Method for producing a semiconductor device, base member for sem does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a semiconductor device, base member for sem, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a semiconductor device, base member for sem will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1680404