4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Kazuaki Ano

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Delamination resistant packaged die having support and...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor
Reexamination Certificate

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Low cost substrate for an integrated circuit device with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Low profile ball-grid array package for high power

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Low profile ball-grid array package for high power

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Low profile ball-grid array package for high power

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-775137

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