Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-10-14
2000-07-04
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257778, 257493, 257729, 257642, 257643, 257784, 257786, H01L 2943, H01L 2160, H01L 2350
Patent
active
060843012
ABSTRACT:
A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.
REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3809625 (1974-05-01), Brown et al.
patent: 4504007 (1985-03-01), Andersen, Jr. et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4883744 (1989-11-01), Feilchenfeld et al.
patent: 4916523 (1990-04-01), Sokolorsky et al.
patent: 4963002 (1990-10-01), Tagusa
patent: 5034345 (1991-07-01), Shirahata
patent: 5108950 (1992-04-01), Wakabayashi et al.
patent: 5115090 (1992-05-01), Sachder et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5272111 (1993-12-01), Kosaki
patent: 5313368 (1994-05-01), Volz et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5393697 (1995-02-01), Chang et al.
patent: 5397863 (1995-03-01), Ardakani et al.
patent: 5438105 (1995-08-01), Nagata
patent: 5473197 (1995-12-01), Idaka et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5668410 (1997-09-01), Yamamoto
patent: 5744557 (1998-04-01), McCormick et al.
patent: 5763532 (1998-06-01), Harrington et al.
patent: 5766808 (1998-06-01), Linde et al.
Chang Shyh-Ming
Jou Jwo-Huei
Lee Yu-Chi
Ackerman Stephen B.
Industrial Technology Industrial Research
Prescott Larry J.
Saile George O.
Williams Alexander Oscar
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