4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Jwei Wien Liu

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active

Anchor for device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling
Reexamination Certificate

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Electro-optical package with drop-in aperture

Optical: systems and elements – Optical modulator
Reexamination Certificate

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Masking layer in substrate cavity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Masking layer in substrate cavity

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Masking layer in substrate cavity

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2369162

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