Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-01-01
2008-01-01
Potter, Roy (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S666000
Reexamination Certificate
active
07314816
ABSTRACT:
A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wires connecting bond pads on the substrate with bond pads on the device. A window is attached to the substrate to form a cavity around the device. A thin masking layer on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer may be any material that resists particle generation. The masking layer on the cavity walls optionally extends out of the cavity and onto the upper surface of the package.
REFERENCES:
patent: 4445274 (1984-05-01), Suzuki et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 5639990 (1997-06-01), Nishihara et al.
patent: 5805427 (1998-09-01), Hoffman
patent: 6060779 (2000-05-01), Machii
patent: 6300673 (2001-10-01), Hoffman et al.
patent: 6459149 (2002-10-01), Shimoe et al.
patent: 6612027 (2003-09-01), Akram
patent: 6630661 (2003-10-01), Hoffman
patent: 6707168 (2004-03-01), Hoffman et al.
patent: 6781231 (2004-08-01), Minervini
patent: 6841412 (2005-01-01), Fisher et al.
Liu Jwei Wien
O'Connor John P.
Brady III Wade James
Brill Charles A.
Potter Roy
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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