4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Juan G. Milla

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High voltage flip-chip component package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Implantable medical device including a surface-mount...

Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Electrical therapeutic systems
Reexamination Certificate

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Implantable medical electronics using high voltage flip chip...

Surgery: light – thermal – and electrical application – Light – thermal – and electrical application
Reexamination Certificate

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Method of forming a high-voltage/high-power die package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of making encapsulated package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-1560529

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