Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1999-04-02
2000-05-02
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438126, 438127, H01L 2144
Patent
active
060571756
ABSTRACT:
An encapsulated package includes a substrate having one or more conductive vias defined therethrough from a first side of the substrate to a second side of the substrate. Conductive bond pads are formed on the first side of the substrate in electrical contact with the one or more conductive vias and conductive package connection pads are formed on the second side of the substrate in electrical contact with the one or more conductive vias. A high voltage component is electrically connected to the conductive bond pads and an encapsulating material is formed over the first side of the substrate including the high voltage component and the conductive bond pads. The encapsulating material has a dielectric strength sufficient for use to block high voltages used in operation of the high voltage components. Further, a method of production allows for mass production of such encapsulated packages.
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Boone Mark R.
Milla Juan G.
Medtronic Inc.
Patton Harold R.
Picardat Kevin M.
Wolde-Michael Girma
Woods Thomas F.
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