Implantable medical electronics using high voltage flip chip...

Details Implantable medical electronics using high voltage flip chip... Implantable medical electronics using high voltage flip chip...

2000-12-26

2003-09-30

Paschall, Mark (Department: 3742)

Surgery: light, thermal, and electrical application

Light, thermal, and electrical application

C607S005000, C607S009000, C607S036000, C361S764000

Reexamination Certificate

active

06626931

ABSTRACT:

The present invention relates generally to implantable medical devices, and more specifically to such devices using high voltage flip chip components.
BACKGROUND OF THE INVENTION
Currently, nearly all high voltage integrated circuit mounting is accomplished with wire bonding. Typical high voltage dice have active terminations on both sides of the die. Wire bonding involves attaching one end of a thin wire to a termination point on a side of a die, attaching the other end of the thin wire to a pad on a substrate, and encapsulating the die and connection points in an encapsulant to prevent damage to the wire bond. Wire bonding has numerous problems. Some of the problems are, for example, wire bonds are fragile and require multiple connections that may also make a structure more fragile.
A typical wire bonded high voltage die package
100
is shown in top view in FIG.
1
A and in side elevation view on FIG.
1
B. Die package
100
includes a substrate
102
, a die
104
having a top side
106
and a bottom side
108
. The die
104
is attached to the substrate
102
by two types of connections, an epoxy
110
connection and two wire bond connections
112
. The epoxy
110
connection is between the substrate
102
and the back side
108
of the die
104
. The wire bond connections
112
include a connection of a wire
116
between a pad
114
on the top side
106
of die
104
and a pad
118
on the substrate
102
.
Because of fragility and problems with arcing and wire damage and because the wires necessarily stick up from the die as shown in
FIG. 1
, once the die
104
is wire bonded on the top side
106
and the substrate
102
, and conductively epoxied to the substrate on the back side
108
, the entire area of the wire bonding connections
112
and die
104
is encapsulated. The encapsulation covers the entire area of the die, in addition to the entire area of the wire bond contact to the substrate, plus the vertical height of the wire off the die. The encapsulant die size is quite large.
As implantable medical devices become smaller and smaller, and as more and more components are added to such devices, the real estate available for components is shrinking. Components too are shrinking in size, but the need for improving the use of available volume and real estate continues.
In implantable medical devices, the footprints of dice and stacked dice packages typically exceed the bottom die size. For example, when wire bonding is used to electrically connect a die to rigid or flexible interposers, the package size is much larger than the bottom die size, and is therefore substantially size inefficient.
SUMMARY OF THE INVENTION
In one embodiment, a method for assembling an implantable medical device includes assembling a substrate containing circuitry for use in a medical device, and mounting a flip chip high voltage die to the substrate.
In another embodiment, a method for reducing the size of an implantable medical device includes preparing a high voltage device with terminations on a single side of the device die for surface mount technology application. The process includes preferably mounting the high voltage die on a reduced size implantable medical device substrate, and assembling the substrate into a reduced size body.
In yet another embodiment, an implantable medical device includes a body, a substrate, and a high voltage die mounted to the substrate using flip chip components. The high voltage die in one embodiment is a die such as that disclosed herein.
Other embodiments are described and claimed.


REFERENCES:
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patent: 5954751 (1999-09-01), Chen et al.
patent: 5963429 (1999-10-01), Chen
patent: 6052623 (2000-04-01), Fenner et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6146743 (2000-11-01), Haq et al.
patent: 6156028 (2000-12-01), Prescott
patent: 6245092 (2001-06-01), Schaldach, Jr.
patent: 689 502 (1997-05-01), None
patent: 0732124 (1996-09-01), None

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