Method of forming a high-voltage/high-power die package

Details Method of forming a high-voltage/high-power die package Method of forming a high-voltage/high-power die package

2006-01-31

2006-01-31

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S786000

Reexamination Certificate

active

06991961

ABSTRACT:
A method for forming a high voltage component package, which includes providing a flexible non-conductive substrate, forming a conductive layer on the substrate, and forming a circuit trace from the conductive layer, the circuit trace having frangible leads. A first side of a component overlies at least a portion of the circuit trace, and the component is coupled to the circuit trace by breaking a frangible lead on the trace and bonding the lead to the component. The flexible substrate is then bent or folded such that another portion of the circuit trace is in proximity to a second side of the component. The trace is coupled to the second side of the component either with a conductive adhesive or by bonding with another frangible trace.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5117282 (1992-05-01), Salatino
patent: 5186632 (1993-02-01), Horton et al.
patent: 5241454 (1993-08-01), Ameen et al.
patent: 5281852 (1994-01-01), Normington
patent: 5394608 (1995-03-01), Tottori et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5463253 (1995-10-01), Waki et al.
patent: 5479051 (1995-12-01), Waki et al.
patent: 5497027 (1996-03-01), Crafts
patent: 5635427 (1997-06-01), Takahashi
patent: 5767576 (1998-06-01), Kobayashi et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5904499 (1999-05-01), Pace
patent: 5953588 (1999-09-01), Camien et al.
patent: 6022757 (2000-02-01), Andoh
patent: RE36613 (2000-03-01), Ball
patent: 6057175 (2000-05-01), Milla et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6245092 (2001-06-01), Schaldach, Jr.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6670217 (2003-12-01), Milla et al.
patent: 2001/0006252 (2001-07-01), Kim et al.
patent: 2002/0121693 (2002-09-01), Milla et al.
patent: 2002/0123172 (2002-09-01), Milla et al.
patent: 2002/0127837 (2002-09-01), Milla
patent: 2002/0151111 (2002-10-01), DiStefano et al.
patent: 1 041 633 (2000-04-01), None
patent: WO 99/41786 (1999-08-01), None
patent: WO 02/49109 (2002-06-01), None
patent: WO 02/060527 (2002-08-01), None
patent: WO 03/019654 (2003-06-01), None

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