4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Beam leads

Jorge Munoz

Inventor

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active

Chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Chip-scale package

Railway mail delivery – Projectors
Reexamination Certificate

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Portable radio-cassette adapter plate

Package and article carriers – Carried by animate bearer – Convertible or combined
Patent

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

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Profile ID: LFUS-PAI-P-948347

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