Semiconductor package

Details Semiconductor package Semiconductor package

1999-01-04

2000-03-21

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

257692, 257666, 257341, H01L 2348, H01L 2352, H01L 2940

Patent

active

060406267

ABSTRACT:
A semiconductor package includes a bottom leadframe having a bottom plate portion and at least one first terminal extending from the bottom plate portion; at least one second terminal being co-planar with the first terminal; a semiconductor power MOSFET die having a bottom surface defining a drain connection and a top surface on which a first metalized region defining a source and a second metalized region defining a gate are disposed, the bottom surface being coupled to the bottom plate of the leadframe such that the first terminal is electrically connected to the drain; a copper plate coupled to and spanning a substantial part of the first metalized region defining the source connection; and at least one beam portion being sized and shaped to couple the copper plate portion to the at least one second terminal such that it is electrically coupled to the source.

REFERENCES:
patent: 4189342 (1980-02-01), Kock
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5665996 (1997-09-01), Williams et al.
patent: 5814884 (1999-09-01), Davis et al.

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