4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Liquid phase etching

John William Osenbach

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Active optical alignment using MEMS mirrors

Optics: measuring and testing – By alignment in lateral direction
Reexamination Certificate

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Bonding of aluminum oxide components to silicon substrates

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Bonding of aluminum oxide components to silicons substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent

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Corrosion protection in the fabrication of optoelectronic assemb

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Patent

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Device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-207308

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