Corrosion protection in the fabrication of optoelectronic assemb

Details Corrosion protection in the fabrication of optoelectronic assemb Corrosion protection in the fabrication of optoelectronic assemb

1999-04-15

2000-10-10

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

438 48, H01L 2100

Patent

active

061301078

ABSTRACT:
The invention is a method for protecting an aluminum layer from corrosion when it is formed by means of a photoresist mask on the same substrate as a multilayer such as titanium, platinum, and gold. A protection layer such as titanium is formed over the aluminum layer prior to stripping the photoresist mask, and is removed subsequent to stripping and prior to bonding components to the aluminum layer.

REFERENCES:
patent: 5178319 (1993-01-01), Coucoulas

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