Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-12-30
2009-02-24
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257SE23057, C257S532000, C257S924000, C257S528000, C257S728000, C257S724000, C257S725000
Reexamination Certificate
active
07495336
ABSTRACT:
An integrated broadband array capacitor includes at least two regions with varying capacitance and response times. The broadband array capacitor is disposable on a socket or is integral with a socket. A method of operating the broadband array capacitor includes responding to load transients from each of the at least two regions. A computing system is also disclosed that includes the broadband array capacitor.
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Suh, D., “Intermetallic Solder With Low Melting Point”, U.S. Patent Appl. No. 11/229,184, filed Sep. 15, 2005.
Auernheimer Joel A.
Holmberg Nicholas
Radhakrishnan Kaladhar
Wood Dustin P.
Greaves John N.
Intel Corporation
Williams Alexander O
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