4. Metal fusion bonding
  5. Process
  6. Applying or distributing fused filler

John L. Parker, Jr.

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Method and apparatus for solder leveling of printed circuit boar

Metal fusion bonding – Process – Applying or distributing fused filler
Patent

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Method of preserving the solderability of copper

Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent

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Via connector and method of making same

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1445738

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